CVE-2016-2065

CVE-2016-2065

sound/soc/msm/qdsp6v2/msm-audio-effects-q6-v2.c in the MSM QDSP6 audio driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service (out-of-bounds write and memory corruption) or possibly have unspecified other impact via a crafted application that makes an ioctl call triggering incorrect use of a parameters pointer.

Source: CVE-2016-2065

CVE-2016-2064 (linux_kernel)

CVE-2016-2064 (linux_kernel)

sound/soc/msm/qdsp6v2/msm-audio-effects-q6-v2.c in the MSM QDSP6 audio driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service (buffer over-read) or possibly have unspecified other impact via a crafted application that makes an ioctl call specifying many commands.

Source: CVE-2016-2064 (linux_kernel)

CVE-2016-2064

CVE-2016-2064

sound/soc/msm/qdsp6v2/msm-audio-effects-q6-v2.c in the MSM QDSP6 audio driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service (buffer over-read) or possibly have unspecified other impact via a crafted application that makes an ioctl call specifying many commands.

Source: CVE-2016-2064

CVE-2016-2063 (linux_kernel)

CVE-2016-2063 (linux_kernel)

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Source: CVE-2016-2063 (linux_kernel)

CVE-2016-2063

CVE-2016-2063

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Source: CVE-2016-2063

CVE-2015-0573 (linux_kernel)

CVE-2015-0573 (linux_kernel)

drivers/media/platform/msm/broadcast/tsc.c in the TSC driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service (invalid pointer dereference) or possibly have unspecified other impact via a crafted application that makes a TSC_GET_CARD_STATUS ioctl call.

Source: CVE-2015-0573 (linux_kernel)

CVE-2015-0573

CVE-2015-0573

drivers/media/platform/msm/broadcast/tsc.c in the TSC driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service (invalid pointer dereference) or possibly have unspecified other impact via a crafted application that makes a TSC_GET_CARD_STATUS ioctl call.

Source: CVE-2015-0573

CVE-2015-0568 (linux_kernel)

CVE-2015-0568 (linux_kernel)

Use-after-free vulnerability in the msm_set_crop function in drivers/media/video/msm/msm_camera.c in the MSM-Camera driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to gain privileges or cause a denial of service (memory corruption) via an application that makes a crafted ioctl call.

Source: CVE-2015-0568 (linux_kernel)